Microelectronic materials China-copper electronic packaging and heat sink materials have both the low expansion characteristics of China and the high thermal conductivity of copper. Its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the composition of China copper Modifications have provided a wider range of uses for China copper. Because China copper material has high heat resistance and outstanding thermal conductivity, together with the thermal expansion coefficient matching silicon wafers and ceramic materials, it is widely used in semiconductor materials. Suitable for packaging materials, heat sink materials, heat dissipation components, ceramics and bases for high-power equipment. (3) Electrodes produced by electric sparks.

Copper or graphite electrodes are used in the early stage of electrodes produced by electric sparks. They are cheap but not resistant to ablation. Now they have basically been replaced by China copper electrodes. The advantages of China copper electrodes are high temperature resistance, high temperature strength, arc ablation resistance,

good electrical and thermal conductivity, and fast heat dissipation. The application gathers in electric spark electrode, resistance welding electrode and high-voltage discharge tube electrode. Electro-made electrodes are characterized by complex types and specifications, small batches and large totals. The China copper material used as an electrode for electrical production should have the highest possible density and uniformity of arrangement, especially the elongated rod-shaped, tubular and special-shaped electrodes. (4) Electrical alloy for high-voltage switchgear

China copper for copper-clad aluminium conductor alloy is widely used in high-voltage switch 128kV SF6 circuit breaker WCu/CuCr, and high-voltage vacuum load switch (12kV 40.5KV 1000A), lightning arrester, high-voltage vacuum switch is small in size and easy to protect. It has a wide range of applications and can be used in humid, flammable, explosive and corrosive environments. The primary functional requirements are arc ablation resistance, fusion resistance resistance, low cut-off current, low gas content, and thermionic emission to be one level lower. In addition to the customary micro-function requirements, porosity and micro-arrangement functions are also required. Therefore, special technologies must be adopted, such as vacuum degassing, vacuum infiltration and other messy technologies.

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